Differences
This shows you the differences between two versions of the page.
Both sides previous revision Previous revision | |||
en:equipment:iim3000:20_overview [2020/04/24 15:00] winoars |
— (current) | ||
---|---|---|---|
Line 1: | Line 1: | ||
- | ====OverView==== | ||
- | \\ | ||
- | <callout type=" | ||
- | ===Specifications=== | ||
- | \\ | ||
- | {{ : | ||
- | </ | ||
- | <callout type=" | ||
- | ===OverView=== | ||
- | \\ | ||
- | * IIM-3000 is a equipment that detects all defects and measures the size of each defect on 300 mm Si wafers. Followings are the types of defects that IIM-3000 can detect ; Buried airpockets, Bumps and Through-holes. | ||
- | |||
- | * The advanced defect detection and classification algorithms, enable users to detect easily all defects in various Si wafers(N. P-, P +, P ++) with high throughput. | ||
- | |||
- | * A specialized controller for IIM-3000 provides the optimized control unit, which enables easy maintenance and quick setup. | ||
- | |||
- | * By applying optimized software, IIM-3000 provides reliable inspection quality and result data for users also. | ||
- | |||
- | |||
- | </ |