Show pageDiscussionOld revisionsBacklinksAdd to bookExport to PDFBack to top This page is read only. You can view the source, but not change it. Ask your administrator if you think this is wrong. ====OverView==== \\ <callout type="primary"> ===Specifications=== \\ {{ :equipment:eis3000:overview.png?nolink |}} </callout> <callout type="info"> ===OverView=== \\ * IIM-3000 is a equipment that detects all defects and measures the size of each defect on 300 mm Si wafers. Followings are the types of defects that IIM-3000 can detect ; Buried airpockets, Bumps and Through-holes. * The advanced defect detection and classification algorithms, enable users to detect easily all defects in various Si wafers(N. P-, P +, P ++) with high throughput. * A specialized controller for IIM-3000 provides the optimized control unit, which enables easy maintenance and quick setup. * By applying optimized software, IIM-3000 provides reliable inspection quality and result data for users also. </callout>